LTCC - Multilayer Ceramic for Wireless and Sensor Applications
نویسندگان
چکیده
LTCC technology has large benefits in microwave applications. Ceramic substrates as well as the gold and silver pastes have excellent physical and electrical properties. Moreover, material and processing costs are competitive to other substrate systems like HTCC and printed circuit boards. A comparison between LTCC and PCB is followed by a listing of commercial LTCC materials and a selection of worldwide foundry services. On the basis of the prototyping line at IMST GmbH the manufacturing process of LTCC modules is described. Finally, with the example of a 25 GHz transceiver module a high integration and cost-effective application is demonstrated.
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